SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS | Patent Publication Number 20230253360

US 20230253360 A1
Patent Number-
Application Number18303300
Filled DateApr 19, 2023
Priority DateApr 5, 2021
Publication DateAug 10, 2023
Original AssigneeSk Group
Current AssigneeSk Hynix
Inventor/ApplicantsJong Hyun KIM
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