SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS | Patent Publication Number 20230253371

US 20230253371 A1
Patent Number-
Application Number18304106
Filled DateApr 20, 2023
Priority DateJan 25, 2021
Publication DateAug 10, 2023
Original AssigneeSk Group
Current AssigneeSk Hynix
Inventor/ApplicantsJong Hoon KIM
Eun Hye DO
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