UNFUSED THERMAL SUPPORT AREA IN 3D FABRICATION SYSTEMS | Patent Publication Number 20230356474

US 20230356474 A1

Patent Number-

Application Number18139460

Filled DateApr 26, 2023

Priority DateOct 25, 2017

Publication DateNov 9, 2023

Original AssigneeHewlett Packard Enterprise

Current AssigneeHewlett Packard Enterprise

Inventor/ApplicantsWei Huang
Gary J. Dispoto

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