FORMING THREE-DIMENSIONAL (3D) ELECTRONIC PARTS | Patent Publication Number 20230373157

US 20230373157 A1
Patent Number-
Application Number18228526
Filled DateJul 31, 2023
Priority DateJul 27, 2016
Publication DateNov 23, 2023
Original AssigneeHewlett Packard Enterprise
Current AssigneeHewlett Packard Enterprise
Inventor/ApplicantsLihua ZHAO
Kristopher J. ERICKSON
Sterling CHAFFINS
Kevin P. DEKAM
Aja HARTMAN
Yan ZHAO
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