SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Patent Publication Number 20230386977

US 20230386977 A1
Patent Number-
Application Number18450216
Filled DateAug 15, 2023
Priority DateMay 17, 2021
Publication DateNov 30, 2023
Original AssigneeSk Group
Current AssigneeSk Hynix
Inventor/ApplicantsHyun Chul SEO
Moon Un HYUN
Hyeong Seok CHOI
Seung Hwan KIM
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