ETCHING COMPOSITION FOR SELECTIVELY ETCHING SILICON NITRIDE, ETCHING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME | Patent Publication Number 20240014044

US 20240014044 A1
Patent Number-
Application Number18335620
Filled DateJun 15, 2023
Priority DateJun 15, 2023
Publication DateJan 11, 2024
Original Assignee
Current AssigneeSk Hynix
Ajou University
Inventor/ApplicantsGo Un KIM
Eun Seok OH
Hyun Goo KANG
Tae Gun PARK
Young Mee KANG
Sang Woo LIM
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