STACK PACKAGE INCLUDING CORE DIE STACKED OVER A CONTROLLER DIE | Patent Publication Number 20240030191

US 20240030191 A1
Patent Number-
Application Number18479280
Filled DateOct 2, 2023
Priority DateOct 16, 2020
Publication DateJan 25, 2024
Original AssigneeSk Group
Current AssigneeSk Hynix
Inventor/ApplicantsBok Kyu CHOI
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