METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED BY THE SAME | Patent Publication Number 20240038720

US 20240038720 A1

Patent Number-

Application Number18111460

Filled DateFeb 17, 2023

Priority DateFeb 17, 2023

Publication DateFeb 1, 2024

Original AssigneeSk Group

Current AssigneeSk Hynix

Inventor/ApplicantsMin Hee PARK
Su Ji UM

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