SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Patent Publication Number 20240071874

US 20240071874 A1
Patent Number-
Application Number18489557
Filled DateOct 18, 2023
Priority Date-
Publication DateFeb 29, 2024
Original AssigneeSk Group
Current AssigneeSk Hynix
Inventor/ApplicantsSung Kyu KIM
Ho Young SON
Mi Seon LEE
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