SEMICONDUCTOR DIE INCLUDING AN ASYMMETRIC PAD ARRAYS, A SEMICONDUCTOR DIE STACK INCLUDING THE SEMICONDUCTOR DIE, AND A HIGH BANDWIDTH MEMORY INCLUDING THE SEMICONDUCTOR DIE STACK | Patent Publication Number 20240071967

US 20240071967 A1
Patent Number-
Application Number18103494
Filled DateJan 31, 2023
Priority Date-
Publication DateFeb 29, 2024
Original Assignee
Current AssigneeSk Hynix
Inventor/ApplicantsChoung Ki SONG
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