Method for providing a fill pattern for an integrated circuit design | Patent Publication Number 20020199162

US 20020199162 A1
Patent NumberUS 06609235 B2
Application Number9887885
Filled DateJun 22, 2001
Priority DateJun 22, 2001
Publication DateDec 26, 2002
Original AssigneeBae Systems
Current AssigneeMind Fusion Llc
Inventor/ApplicantsTatia B. Butts
S. Ram Ramaswamy
Charles N. Alcorn
Charles N. Alcorn
S. Ram Ramaswamy
Tatia E. Butts
Arnett J. III Brown
Arnett J. Brown, III
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