Semiconductor package structure | Patent Publication Number 20130153944

US 20130153944 A1
Patent NumberUS 08587013 B2
Application Number13670438
Filled DateNov 6, 2012
Priority DateNov 6, 2012
Publication DateJun 20, 2013
Original AssigneeGenesis Photonics Inc.
Current AssigneeGenesis Photonics Inc.
Liteon Technology Corporation
Inventor/ApplicantsYi-Ju Shih
Chih-Ling Wu
Yi-Ru Huang
Po-Jen Su
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