Package structure and manufacturing method thereof | Patent Publication Number 20180366623

US 20180366623 A1
Patent NumberUS 10916685 B2
Application Number16009005
Filled DateJun 14, 2018
Priority DateJun 14, 2017
Publication DateDec 20, 2018
Original AssigneeLiteon Technology Corporation
Current AssigneeLiteon Opto Technology Changzhou Co. Ltd.
Liteon Technology Corporation
Inventor/ApplicantsKai-Chieh Liang
Wei-Te Cheng
WEI-TE CHENG
Meng-Sung Chou
Kuo-Ming Chiu
KUO-MING CHIU
KAI-CHIEH LIANG
MENG-SUNG CHOU
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