Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | Patent Publication Number 20220173010

US 20220173010 A1
Patent NumberUS 11908768 B2
Application Number17671635
Filled DateFeb 15, 2022
Priority DateMar 25, 2019
Publication DateJun 2, 2022
Original AssigneeMitsubishi Electric Corporation
Current AssigneeMitsubishi Electric Corporation
Inventor/ApplicantsTomoya Oohiraki
Takeshi Kitahara
Yoshiyuki Nagatomo
Ryohei Yumoto
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