Radio frequency silicon on insulator structure with superior performance, stability, and manufacturability | Patent Publication Number 20230215759

US 20230215759 A1
Patent NumberUS 11942360 B2
Application Number18182823
Filled DateMar 13, 2023
Priority DateJul 13, 2018
Publication DateJul 6, 2023
Original AssigneeGlobalwafers Co. Ltd.
Current AssigneeGlobalwafers Co. Ltd.
Inventor/ApplicantsLeif Jensen
Hariprasad Sreedharamurthy
Robert W. Standley
Jeffrey L. Libbert
Michael R. Seacrist
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