Heat transfer interfaces for circuit card assembly (CCA) modules | Patent Publication Number 20230345676

US 20230345676 A1
Patent NumberUS 11839061 B2
Application Number17728653
Filled DateApr 25, 2022
Priority DateApr 25, 2022
Publication DateOct 26, 2023
Original AssigneeCollins Aerospace
Current AssigneeCollins Aerospace
Inventor/ApplicantsAlexander Trotman
Michael Doe, Jr.
Judy Schwartz
Robert J. DeFelice
Josh Kamp
Anthony Matthew DeLugan
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