Reza Argenty Pagaila > Patents

Doc No	Title	Issue date
08389330	Integrated circuit package system with package stand-off and method of manufacture thereof	Mar 5, 2013
08383457	Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect	Feb 26, 2013
08378383	Semiconductor device and method of forming a shielding layer between stacked semiconductor die	Feb 19, 2013
08378477	Integrated circuit packaging system with film encapsulation and method of manufacture thereof	Feb 19, 2013
08367470	Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die	Feb 5, 2013
08367480	Semiconductor device and method of forming dam material around periphery of die to reduce warpage	Feb 5, 2013
08368187	Semiconductor device and method of forming air gap adjacent to stress sensitive region of the die	Feb 5, 2013
08354297	Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die	Jan 15, 2013
08349657	Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices	Jan 8, 2013
08349735	Semiconductor device and method of forming conductive TSV with insulating annular ring	Jan 8, 2013