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Patents Prosecuted

Application numberTitle of the patentIPCFiling DateDecision Date
18343113 MEMORY SYSTEM AND OPERATING METHOD THEREOF G06F Jun 27, 2023
18343537 SEMICONDUCTOR DEVICE RELATED TO CALIBRATING TERMINATION RESISTANCE G11C, H03K Jun 27, 2023
18342538 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF H01L Jun 26, 2023
18340214 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF G11C Jun 22, 2023
18339821 MEMORY DEVICE AND METHOD FOR FABRICATING THE MEMORY DEVICE H10B Jun 21, 2023
18338797 DECODING DEVICE FOR DETERMINING WHETHER TO DECODE DATA UNIT, AND OPERATING METHOD THEREOF G06F Jun 20, 2023
18335620 ETCHING COMPOSITION FOR SELECTIVELY ETCHING SILICON NITRIDE, ETCHING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME H01L Jun 14, 2023
18334583 Semiconductor memory device and methods of manufacturing and operating the same G11C, H10N, H10B Jun 13, 2023 Mar 25, 2024
18334659 PROCESSING-IN-MEMORY (PIM) SYSTEM AND OPERATING METHODS OF THE PIM SYSTEM G06F, H03K Jun 13, 2023
18334261 DATA OUTPUT BUFFER AND SEMICONDUCTOR APPARATUS INCLUDING THE SAME G11C, H03K Jun 12, 2023
18332647 METHOD OF PERFORMING A MULTIPLICATION AND ACCUMULATION (MAC) OPERATION IN A PROCESSING-IN-MEMORY (PIM) DEVICE G06F Jun 8, 2023
18207604 MEMORY SYSTEM AND METHOD OF OPERATING THE SAME G06F Jun 7, 2023
18331012 STACKED INTEGRATED CIRCUIT G11C Jun 6, 2023
18330062 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR MEMORY DEVICE H01L, H10B Jun 5, 2023
18330239 IMAGE SENSING DEVICE INCLUDING LIGHT SHIELDING PATTERN H04N, H01L Jun 5, 2023
18328660 Semiconductor device and method of manufacturing the same H01L Jun 1, 2023 Apr 8, 2024
18327732 VERTICAL NAND FLASH TYPE SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME G11C, G06N May 31, 2023
18327195 IMAGE SENSING DEVICE H01L May 31, 2023
18326671 Delay line, a delay locked loop circuit and a semiconductor apparatus using the delay line and the delay locked loop circuit H03K, H03L May 30, 2023 Mar 25, 2024
18322440 SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYER H01L May 22, 2023
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