Patents Prosecuted
Application number | Title of the patent | IPC | Filing Date | Decision Date |
---|---|---|---|---|
18343113 | MEMORY SYSTEM AND OPERATING METHOD THEREOF | G06F | Jun 27, 2023 | |
18343537 | SEMICONDUCTOR DEVICE RELATED TO CALIBRATING TERMINATION RESISTANCE | G11C, H03K | Jun 27, 2023 | |
18342538 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | H01L | Jun 26, 2023 | |
18340214 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | G11C | Jun 22, 2023 | |
18339821 | MEMORY DEVICE AND METHOD FOR FABRICATING THE MEMORY DEVICE | H10B | Jun 21, 2023 | |
18338797 | DECODING DEVICE FOR DETERMINING WHETHER TO DECODE DATA UNIT, AND OPERATING METHOD THEREOF | G06F | Jun 20, 2023 | |
18335620 | ETCHING COMPOSITION FOR SELECTIVELY ETCHING SILICON NITRIDE, ETCHING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME | H01L | Jun 14, 2023 | |
18334583 | Semiconductor memory device and methods of manufacturing and operating the same | G11C, H10N, H10B | Jun 13, 2023 | Mar 25, 2024 |
18334659 | PROCESSING-IN-MEMORY (PIM) SYSTEM AND OPERATING METHODS OF THE PIM SYSTEM | G06F, H03K | Jun 13, 2023 | |
18334261 | DATA OUTPUT BUFFER AND SEMICONDUCTOR APPARATUS INCLUDING THE SAME | G11C, H03K | Jun 12, 2023 | |
18332647 | METHOD OF PERFORMING A MULTIPLICATION AND ACCUMULATION (MAC) OPERATION IN A PROCESSING-IN-MEMORY (PIM) DEVICE | G06F | Jun 8, 2023 | |
18207604 | MEMORY SYSTEM AND METHOD OF OPERATING THE SAME | G06F | Jun 7, 2023 | |
18331012 | STACKED INTEGRATED CIRCUIT | G11C | Jun 6, 2023 | |
18330062 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR MEMORY DEVICE | H01L, H10B | Jun 5, 2023 | |
18330239 | IMAGE SENSING DEVICE INCLUDING LIGHT SHIELDING PATTERN | H04N, H01L | Jun 5, 2023 | |
18328660 | Semiconductor device and method of manufacturing the same | H01L | Jun 1, 2023 | Apr 8, 2024 |
18327732 | VERTICAL NAND FLASH TYPE SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME | G11C, G06N | May 31, 2023 | |
18327195 | IMAGE SENSING DEVICE | H01L | May 31, 2023 | |
18326671 | Delay line, a delay locked loop circuit and a semiconductor apparatus using the delay line and the delay locked loop circuit | H03K, H03L | May 30, 2023 | Mar 25, 2024 |
18322440 | SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYER | H01L | May 22, 2023 |