Patents Prosecuted
Application number | Title of the patent | IPC | Filing Date | Decision Date |
---|---|---|---|---|
18182219 | SHIFT ARRAY CIRCUIT AND ARITHMETIC CIRCUIT INCLUDING THE SHIFT ARRAY CIRCUIT | G06F | Mar 9, 2023 | |
18119198 | Semiconductor device and manufacturing method of the semiconductor device | H10B, H01L | Mar 7, 2023 | Apr 1, 2024 |
18119216 | IMAGE SENSOR RELATED TO MEASURING DISTANCE | H04N, G01S | Mar 7, 2023 | |
18118634 | PROCESSING-IN-MEMORY (PIM) SYSTEM AND OPERATING METHODS OF THE PIM SYSTEM | G06F | Mar 6, 2023 | |
18179361 | MEMORY CONTROLLER AND METHOD OF OPERATING THE SAME | G06F | Mar 6, 2023 | |
18118447 | STORAGE DEVICE, HOST DEVICE, AND ELECTRONIC DEVICE | G06F | Mar 6, 2023 | |
18117851 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | H01L | Mar 5, 2023 | |
18179259 | IMAGE SENSOR | H01L | Mar 5, 2023 | |
18178531 | MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE | H01L, G11C | Mar 5, 2023 | |
18178389 | SELECTOR DEVICE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | H10B | Mar 2, 2023 | |
18177760 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | H01L | Mar 2, 2023 | |
18177756 | MEMORY DEVICE AND MEMORY SYSTEM | G11C | Mar 2, 2023 | |
18116001 | SEMICONDUCTOR DEVICE RELATED TO CALIBRATING A TERMINATION RESISTANCE | G06F, G11C | Feb 28, 2023 | |
18115544 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR MEMORY DEVICE | H10B | Feb 27, 2023 | |
18115456 | IMAGE PROCESSING DEVICE AND IMAGE PROCESSING METHOD | H04N | Feb 27, 2023 | |
18175548 | MEMORY CONTROLLER AND MEMORY SYSTEM INCLUDING THE SAME | G06F | Feb 27, 2023 | |
18114140 | NORMALIZER AND MULTIPLICATION AND ACCUMULATION (MAC) OPERATOR INCLUDING THE NORMALIZER | G06F | Feb 23, 2023 | |
18173068 | STORAGE DEVICE AND METHOD OF OPERATING THE SAME | G06F | Feb 22, 2023 | |
18111437 | SIGNAL INPUT/OUTPUT CIRCUIT AND METHOD OF OPERATING THE SIGNAL INPUT/OUTPUT CIRCUIT | H03F | Feb 16, 2023 | |
18111460 | METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED BY THE SAME | H10B, H01L | Feb 16, 2023 |