Method for providing a fill pattern for an integrated circuit design | Patent Number 06609235

US 06609235 B2
Application Number9887885
Publication NumberUS 20020199162 A1
Pendency2 years, 1 month, 28 days
Filled DateJun 22, 2001
Priority DateJun 22, 2001
Publication DateDec 26, 2002
Expiration DateJun 22, 2021
Inventor/ApplicantsCharles N. Alcorn
S. Ram Ramaswamy
Tatia B. Butts
Arnett J. III Brown
Tatia E. Butts
Charles N. Alcorn
S. Ram Ramaswamy
Arnett J. Brown, III
ExaminesROSSOSHEK, YELENA
Art Unit2825
Technology Center2800
Assignments
Mind Fusion Llc
Current
Bae Systems Information And Electronic Systems IntegrationBae Systems
Original
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