Semiconductor package structure | Patent Number 08587013

US 08587013 B2
Application Number13670438
Publication NumberUS 20130153944 A1
Pendency1 year, 13 days
Filled DateNov 6, 2012
Priority DateNov 6, 2012
Publication DateJun 20, 2013
Expiration DateNov 5, 2032
Inventor/ApplicantsChih-Ling Wu
Po-Jen Su
Yi-Ru Huang
Yi-Ju Shih
ExaminesTRAN, TAN N
Art Unit2826
Technology Center2800
Assignments
Genesis Photonics Inc.
Current
Liteon Technology Corporation
Current
Genesis Photonics Inc.
Original
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