Package structure and manufacturing method thereof | Patent Number 10916685
US 10916685 B2Filled DateJun 14, 2018
Priority DateJun 14, 2017
Publication DateDec 20, 2018
Expiration DateJun 13, 2037
Inventor/ApplicantsMeng-Sung Chou
KUO-MING CHIU
MENG-SUNG CHOU
Kai-Chieh Liang
Kuo-Ming Chiu
KAI-CHIEH LIANG
Wei-Te Cheng
WEI-TE CHENG
KUO-MING CHIU
MENG-SUNG CHOU
Kai-Chieh Liang
Kuo-Ming Chiu
KAI-CHIEH LIANG
Wei-Te Cheng
WEI-TE CHENG
ExaminesKIM, SU C
Art Unit2899
Technology Center2800
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