Heat transfer interfaces for circuit card assembly (CCA) modules | Patent Number 11839061

US 11839061 B2
Application Number17728653
Publication NumberUS 20230345676 A1
Pendency1 year, 7 months, 14 days
Filled DateApr 25, 2022
Priority DateApr 25, 2022
Publication DateOct 26, 2023
Expiration DateApr 24, 2042
Inventor/ApplicantsMichael Doe, Jr.
Alexander Trotman
Josh Kamp
Anthony Matthew DeLugan
Robert J. DeFelice
Judy Schwartz
ExaminesFENG, ZHENGFU J
Art Unit2835
Technology Center2800
Assignments
Collins Aerospace
Current
Collins Aerospace
Original
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