Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | Patent Number 11908768

US 11908768 B2
Application Number17671635
Publication NumberUS 20220173010 A1
Pendency2 years, 5 days
Filled DateFeb 15, 2022
Priority DateMar 25, 2019
Publication DateJun 2, 2022
Expiration DateMar 24, 2039
Inventor/ApplicantsRyohei Yumoto
Tomoya Oohiraki
Takeshi Kitahara
Yoshiyuki Nagatomo
ExaminesCHEN, XIAOLIANG
Art Unit2848
Technology Center2800
Assignments
Mitsubishi Electric Corporation
Current
Mitsubishi Materials Silicon Corp.Mitsubishi Electric Corporation
Original
Law Firm
You must be logged in to view
Login
Attorneys
Subscription-Only
View Concierge Program
Patent Prosecution report image

Empower your practice with Patexia Publication Prosecution IP Module.

Get access to our exclusive rankings and unlock powerful data.
Check our Latest ReportPurchase IP Module

Looking for a Publication Attorney?

Get in touch with our team or create your account to start exploring a network of over 120K attorneys.